Materials for high-density electronic packaging and interconnection (Record no. 45512)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 01558nam a2200313Ia 4500 |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.381/046 |
| 245 10 - TITLE STATEMENT | |
| Title | Materials for high-density electronic packaging and interconnection |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication | Washington, D.C. : |
| Name of publisher | National Academy Press ; |
| Place of publication | Alexandria, VA : |
| Name of publisher | Available from Defense Technical Information Center, Cameron Station, |
| Year of publication | 1990. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | xiv, 139 p. : |
| Other physical details | ill. |
| 500 ## - GENERAL NOTE | |
| General note | "NMAB-449." |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical Term | Electronic packaging |
| Topical Term | Electrical engineering |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://site.ebrary.com/lib/rucke/Doc?id=10060398 |
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