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Lead-free solder interconnect reliability [electronic resource] / edited by Dongkai Shangguan.

Contributor(s): Material type: TextPublication details: Materials Park, OH : ASM International, 2005.Description: x, 292 p. : illSubject(s): Genre/Form: DDC classification:
  • 621.381/046 22
LOC classification:
  • TK7870.15 .L425 2005eb
Online resources:
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Includes bibliographical references and index.

Electronic reproduction. Palo Alto, Calif. : ebrary, 2013. Available via World Wide Web. Access may be limited to ebrary affiliated libraries.

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