01873nam a2200361 a 4500001001200000003000800012006001900020007001500039008004100054010001700095020002900112020002600141020002500167020002500192020002700217040002100244035002100265050002700286082002000313100002900333245015600362260003500518300002500553504005100578505025000629520023500879533015201114650005101266655002901317700002201346710001701368856012601385ebr10494525CaPaEBRm        u        cr cn|||||||||110509s2011    njuad   sb    001 0 eng d  z  2011019534  z9780470827802 (hardback)  z9780470827826 (oBook)  z9780470828410 (ePub)  z9781118082829 (Mobi)  z9780470827819 (e-book)  aCaPaEBRcCaPaEBR  a(OCoLC)75628085514aTK7870.15b.L58 2011eb04a621.381/0462231 aLiu, S.q(Sheng),d1963-10aModeling and simulation for microelectronic packaging assemblyh[electronic resource] :bmanufacturing, reliability and testing /cSheng Liu, Yong Liu.  aHoboken, N.J. :bWiley,c2011.  axxii, 564 p. :bill.  aIncludes bibliographical references and index.0 apt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging.  a"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--cProvided by publisher.  aElectronic reproduction.bPalo Alto, Calif. :cebrary,d2011.nAvailable via World Wide Web.nAccess may be limited to ebrary affiliated libraries. 0aMicroelectronic packagingxSimulation methods. 7aElectronic books.2local1 aLiu, Yong,d1962-2 aebrary, Inc.40uhttp://site.ebrary.com/lib/rucke/Doc?id=10494525zAn electronic book accessible through the World Wide Web; click to view