TY  - BOOK
AU  - Liu,S.
AU  - Liu,Yong
ED  - ebrary, Inc.
TI  - Modeling and simulation for microelectronic packaging assembly: manufacturing, reliability and testing 
AV  - TK7870.15 .L58 2011eb
U1  - 621.381/046 23
PY  - 2011///
CY  - Hoboken, N.J.
PB  - Wiley
KW  - Microelectronic packaging
KW  - Simulation methods
KW  - Electronic books
KW  - local
N1  - Includes bibliographical references and index; pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging; Electronic reproduction; Palo Alto, Calif.; ebrary; 2011; Available via World Wide Web; Access may be limited to ebrary affiliated libraries
N2  - "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
UR  - http://site.ebrary.com/lib/rucke/Doc?id=10494525
ER  -