01558nam a2200313Ia 4500001001200000003000800012006001900020007001500039008004100054010001700095020001500112040002100127035002000148050002700168082002000195110010100215245028500316260014500601300002400746500001600770504004100786533015200827650003700979650003901016655002901055710001701084856012601101999001701227ebr10060398CaPaEBRm        u        cr cn|||||||||900201s1990    dcua    sb    000 0 eng d  z   90060385   z030904233X  aCaPaEBRcCaPaEBR  a(OCoLC)7077303114aTK7870.15b.N38 1990eb04a621.381/0462202 aNational Research Council (U.S.).bCommittee on Materials for High-Density Electronic Packaging.10aMaterials for high-density electronic packaging and interconnectionh[electronic resource] :breport of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.  aWashington, D.C. :bNational Academy Press ;aAlexandria, VA :bAvailable from Defense Technical Information Center, Cameron Station,c1990.  axiv, 139 p. :bill.  a"NMAB-449."  aIncludes bibliographical references.  aElectronic reproduction.bPalo Alto, Calif. :cebrary,d2009.nAvailable via World Wide Web.nAccess may be limited to ebrary affiliated libraries. 0aElectronic packagingxMaterials. 0aElectrical engineeringxMaterials. 7aElectronic books.2local2 aebrary, Inc.40uhttp://site.ebrary.com/lib/rucke/Doc?id=10060398zAn electronic book accessible through the World Wide Web; click to view  c45512d45512