01701nam a2200337Ia 4500001001200000003000800012006001900020007001500039008004100054020001800095020001500113040002100128035002100149050002400170111010000194245022000294246010400514246009800618260005400716300001900770504005100789533015200840650004900992650006201041655002901103710002301132710004801155710001701203856012601220999001701346ebr10328966CaPaEBRm        u        cr cn|||||||||040219s2003    ohua    sb    001 0 eng d  z9780871707888  z0871707888  aCaPaEBRcCaPaEBR  a(OCoLC)64682731514aTK7871b.I68 2003eb2 aInternational Symposium for Testing and Failure Analysisn(29th :d2003 :cSanta Clara, Calif.)10aISTFA 2003h[electronic resource] :bproceedings of the 29th International Symposium for Testing and Failure Analysis, 2-6 November 2003, Santa Clara Convention Center, Santa Clara, California /csponsored by EDFAS.30aProceedings of the 29th International Symposium for Testing and Failure Analysis, 2-6 November 200334aConference proceedings from the 29th International Symposium for Testing and Failure Analysis  aMaterials Park, Ohio :bASM International,c2003.  a518 p. :bill.  aIncludes bibliographical references and index.  aElectronic reproduction.bPalo Alto, Calif. :cebrary,d2009.nAvailable via World Wide Web.nAccess may be limited to ebrary affiliated libraries. 0aElectronicsxMaterialsxTestingvCongresses. 0aElectronic apparatus and appliancesxTestingvCongresses. 7aElectronic books.2local2 aASM International.2 aElectronic Device Failure Analysis Society.2 aebrary, Inc.40uhttp://site.ebrary.com/lib/rucke/Doc?id=10328966zAn electronic book accessible through the World Wide Web; click to view  c54780d54780