01673nam a2200337Ia 4500001001200000003000800012006001900020007001500039008004100054020001500095040002100110035002100131050002400152111009600176245019700272246008400469246009800553260005300651300002400704500003300728504005100761533015200812650004900964650006201013655002901075710002301104710004801127710001701175856012601192999001701318ebr10320364CaPaEBRm        u        cr cn|||||||||010517s2000    ohua    sb    101 0 eng d  z0871707012  aCaPaEBRcCaPaEBR  a(OCoLC)64782918914aTA409b.I577 2000eb2 aInternational Symposium for Testing and Failure Analysisn(26th :d2000 :cBellevue, Wash.)10aISTFA 2000h[electronic resource] :bproceedings of the 26th International Symposium for Testing and Failure Analysis, 12-16 November 2000, Meydenbauer Convention Center, Bellevue, Washington.30aProceedings of the 26th International Symposium or Testing and Failure Analysis3 aConference Proceedings from the 26th International Symposium for Testing and Failure Analysis  aMaterials Park, OH :bASM International,cc2000.  axvi, 577 p. :bill.  a"Sponsored by EDFAS, ISTFA".  aIncludes bibliographical references and index.  aElectronic reproduction.bPalo Alto, Calif. :cebrary,d2009.nAvailable via World Wide Web.nAccess may be limited to ebrary affiliated libraries. 0aElectronicsxMaterialsxTestingvCongresses. 0aElectronic apparatus and appliancesxTestingvCongresses. 7aElectronic books.2local2 aASM International.2 aElectronic Device Failure Analysis Society.2 aebrary, Inc.40uhttp://site.ebrary.com/lib/rucke/Doc?id=10320364zAn electronic book accessible through the World Wide Web; click to view  c60864d60864