TY  - BOOK
AU  - Shangguan,Dongkai
ED  - ebrary, Inc.
TI  - Lead-free solder interconnect reliability
AV  - TK7870.15 .L425 2005eb
U1  - 621.381/046 22
PY  - 2005///
CY  - Materials Park, OH
PB  - ASM International
KW  - Microelectronic packaging
KW  - Reliability
KW  - Solder and soldering
KW  - Lead-free electronics manufacturing processes
KW  - Electronic books
KW  - local
N1  - Includes bibliographical references and index; Electronic reproduction; Palo Alto, Calif.; ebrary; 2013; Available via World Wide Web; Access may be limited to ebrary affiliated libraries
UR  - http://site.ebrary.com/lib/rucke/Doc?id=10320384
ER  -