01896nam a2200421 i 4500 ebr10910126 CaPaEBR m o d cr cn||||||||| 140828t20142014njua ob 001 0 eng d 9781118831335 9781118831359 (e-book) CaPaEBR eng rda pn CaPaEBR (OCoLC)885378211 TK7870.15 .A3236 2014eb 621.381/046 23 Adhesion in microelectronics / edited by K. L. Mittal and Tanweer Ahsan. Hoboken, New Jersey ; Salem, Massachusetts : Scrivener Publishing : Wiley, 2014. �2014 1 online resource (367 pages) : illustrations. text rdacontent computer rdamedia online resource rdacarrier Adhesion and Adhesives: Fundamental and Applied Aspects Includes bibliographical references and index. Description based on print version record. Electronic reproduction. Palo Alto, Calif. : ebrary, 2014. Available via World Wide Web. Access may be limited to ebrary affiliated libraries. Microelectronic packaging Materials. Adhesives. Adhesive joints. Electronic books. Mittal, K. L., 1945- editor. Ahsan, Tanweer, editor. Print version: Adhesion in microelectronics. Hoboken, New Jersey ; Salem, Massachusetts : Scrivener Publishing ; Wiley, c2014 xiv, 347 pages Adhesion and adhesives. Fundamental and applied aspects. 9781118831335 2014029765 ebrary. Adhesion and adhesives. Fundamental and applied aspects. http://site.ebrary.com/lib/rucke/Doc?id=10910126 An electronic book accessible through the World Wide Web; click to view 71891 71891