@book{79489,
	author = {Bailey, Christopher. and ebrary, Inc.},
	title = {Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging},
	publisher = {Emerald Group Publishing,},
	year = {c2006.},
	series = {Soldering & surface mount technology ;},
	address = {Bradford, England :},
	url = {http://site.ebrary.com/lib/rucke/Doc?id=10132649}
}