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    <title>Components, packaging and manufacturing technology II</title>
    <subTitle>selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia</subTitle>
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  <name type="personal">
    <namePart>Wu, Andy</namePart>
    <role>
      <roleTerm type="text">editor.</roleTerm>
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  </name>
  <typeOfResource>text</typeOfResource>
  <genre authority="marc">bibliography</genre>
  <genre authority="">Electronic books.</genre>
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    <dateIssued encoding="marc">2014</dateIssued>
    <copyrightDate encoding="marc">2014</copyrightDate>
    <issuance>monographic</issuance>
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  <language>
    <languageTerm authority="iso639-2b" type="code">eng</languageTerm>
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  <physicalDescription>
    <extent>1 online resource (245 pages) : illustrations.</extent>
  </physicalDescription>
  <note type="statement of responsibility">edited by Andy Wu.</note>
  <note>Includes bibliographical references and indexes.</note>
  <subject authority="lcsh">
    <topic>Electronic apparatus and appliances</topic>
    <topic>Congresses</topic>
  </subject>
  <subject authority="lcsh">
    <topic>Electronic packaging</topic>
    <topic>Congresses</topic>
  </subject>
  <subject authority="lcsh">
    <topic>Microelectronic packaging</topic>
    <topic>Congresses</topic>
  </subject>
  <subject authority="lcsh">
    <topic>Manufacturing processes</topic>
    <topic>Congresses</topic>
  </subject>
  <classification authority="lcc">TK7801 .C667 2014eb</classification>
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      <title>Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia</title>
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    <originInfo>
      <publisher>Zurich, Switzerland : TTP, c2014 </publisher>
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    <physicalDescription>
      <extent>241 pages </extent>
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    <identifier type="issn">1662-7482 </identifier>
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    <titleInfo>
      <title>Applied mechanics and materials ; Volume 509</title>
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