000			01904nam a2200373 a 4500
001			ebr10494525
003			CaPaEBR
006			m u
007			cr cn|||||||||
008			110509s2011 njuad sb 001 0 eng d
010			_z 2011019534
020			_z9780470827802 (hardback)
020			_z9780470827826 (oBook)
020			_z9780470828410 (ePub)
020			_z9781118082829 (Mobi)
020			_z9780470827819 (e-book)
040			_aCaPaEBR _cCaPaEBR
035			_a(OCoLC)756280855
050	1	4	_aTK7870.15 _b.L58 2011eb
082	0	4	_a621.381/046 _223
100	1		_aLiu, S. _q(Sheng), _d1963-
245	1	0	_aModeling and simulation for microelectronic packaging assembly _h[electronic resource] : _bmanufacturing, reliability and testing / _cSheng Liu, Yong Liu.
260			_aHoboken, N.J. : _bWiley, _c2011.
300			_axxii, 564 p. : _bill.
504			_aIncludes bibliographical references and index.
505	0		_apt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging.
520			_a"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- _cProvided by publisher.
533			_aElectronic reproduction. _bPalo Alto, Calif. : _cebrary, _d2011. _nAvailable via World Wide Web. _nAccess may be limited to ebrary affiliated libraries.
650		0	_aMicroelectronic packaging _xSimulation methods.
655		7	_aElectronic books. _2local
700	1		_aLiu, Yong, _d1962-
710	2		_aebrary, Inc.
856	4	0	_uhttp://site.ebrary.com/lib/rucke/Doc?id=10494525 _zAn electronic book accessible through the World Wide Web; click to view
999			_c129875 _d129875