000 01250nam a2200325Ia 4500
001 ebr10659144
003 CaPaEBR
006 m u
007 cr cn|||||||||
008 081106s2009 nyua sb 001 0 eng d
010 _z 2008047491
020 _z1606922661 (hardcover)
020 _z9781606922668 (hardcover)
020 _z9781616682705
040 _aCaPaEBR
_cCaPaEBR
035 _a(OCoLC)608692447
050 1 4 _aTK453
_b.R43 2009eb
082 0 4 _a537/.24
_223
245 0 0 _aRecent advances in dielectric materials
_h[electronic resource] /
_cAi Huang, editor.
260 _aNew York :
_bNova Science Publishers,
_cc2009.
300 _axiv, 792 p. :
_bill. (some col.)
504 _aIncludes bibliographical references and index.
533 _aElectronic reproduction.
_bPalo Alto, Calif. :
_cebrary,
_d2013.
_nAvailable via World Wide Web.
_nAccess may be limited to ebrary affiliated libraries.
650 0 _aDielectrics.
650 0 _aInterconnects (Integrated circuit technology)
655 7 _aElectronic books.
_2local
700 1 _aHuang, Ai,
_d1965-
710 2 _aebrary, Inc.
856 4 0 _uhttp://site.ebrary.com/lib/rucke/Doc?id=10659144
_zAn electronic book accessible through the World Wide Web; click to view
999 _c166298
_d166298