000 01363nam a2200349Ia 4500
001 ebr10745205
003 CaPaEBR
006 m o u
007 cr cn|||||||||
008 130606s2013 enka sb 001 0 eng d
010 _z 2013015108
020 _z9780470972878 (cloth)
020 _z9781118536629
040 _aCaPaEBR
_cCaPaEBR
035 _a(OCoLC)847842764
050 1 4 _aTJ1191.5
_b.M4983 2013eb
082 0 4 _a671.3/5
_223
245 0 0 _aMicro cutting
_h[electronic resource] :
_bfundamentals and applications /
_cKai Cheng, Dehong Huo, editors.
246 3 0 _aMicrocutting
260 _aChichester, West Sussex, United Kingdom ;
_aNew York :
_bJohn Wiley & Sons Inc.,
_c2013.
300 _axvii, 348 p. :
_bcol. ill.
490 0 _aWiley Microsystem and nanotechnology series (ME20)
504 _aIncludes bibliographical references and index.
533 _aElectronic reproduction.
_bPalo Alto, Calif. :
_cebrary,
_d2013.
_nAvailable via World Wide Web.
_nAccess may be limited to ebrary affiliated libraries.
650 0 _aMicromachining.
650 0 _aMicromechanics.
655 7 _aElectronic books.
_2local
700 1 _aCheng, K.
_q(Kai)
700 1 _aHuo, Dehong.
710 2 _aebrary, Inc.
856 4 0 _uhttp://site.ebrary.com/lib/rucke/Doc?id=10745205
_zAn electronic book accessible through the World Wide Web; click to view
999 _c32714
_d32714