000			01558nam a2200313Ia 4500
001			ebr10060398
003			CaPaEBR
006			m u
007			cr cn|||||||||
008			900201s1990 dcua sb 000 0 eng d
010			_z 90060385
020			_z030904233X
040			_aCaPaEBR _cCaPaEBR
035			_a(OCoLC)70773031
050	1	4	_aTK7870.15 _b.N38 1990eb
082	0	4	_a621.381/046 _220
110	2		_aNational Research Council (U.S.). _bCommittee on Materials for High-Density Electronic Packaging.
245	1	0	_aMaterials for high-density electronic packaging and interconnection _h[electronic resource] : _breport of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
260			_aWashington, D.C. : _bNational Academy Press ; _aAlexandria, VA : _bAvailable from Defense Technical Information Center, Cameron Station, _c1990.
300			_axiv, 139 p. : _bill.
500			_a"NMAB-449."
504			_aIncludes bibliographical references.
533			_aElectronic reproduction. _bPalo Alto, Calif. : _cebrary, _d2009. _nAvailable via World Wide Web. _nAccess may be limited to ebrary affiliated libraries.
650		0	_aElectronic packaging _xMaterials.
650		0	_aElectrical engineering _xMaterials.
655		7	_aElectronic books. _2local
710	2		_aebrary, Inc.
856	4	0	_uhttp://site.ebrary.com/lib/rucke/Doc?id=10060398 _zAn electronic book accessible through the World Wide Web; click to view
999			_c45512 _d45512