000 01271nam a2200301Ia 4500
001 ebr10079920
003 CaPaEBR
006 m u
007 cr cn|||||||||
008 041221s2004 njua sb 001 0 eng d
020 _z9812560610 (cased)
040 _aCaPaEBR
_cCaPaEBR
035 _a(OCoLC)70721099
050 1 4 _aR857.M3
_bT46 2004eb
100 1 _aTeoh, Swee Hin.
245 1 0 _aEngineering materials for biomedical applications
_h[electronic resource] /
_cTeoh Swee Hin.
260 _aHackensack, N.J. ;
_aHong Kong :
_bWorld Scientific Pub.,
_cc2004.
300 _axvii, 350 p. :
_bill. (some col.).
490 1 _aBiomaterials engineering and processing series ;
_vv. 1
504 _aIncludes bibliographical references and index.
533 _aElectronic reproduction.
_bPalo Alto, Calif. :
_cebrary,
_d2009.
_nAvailable via World Wide Web.
_nAccess may be limited to ebrary affiliated libraries.
650 0 _aBiomedical materials.
650 0 _aBiomedical engineering.
655 7 _aElectronic books.
_2local
710 2 _aebrary, Inc.
830 0 _aBiomaterials engineering and processing series ;
_vv. 1.
856 4 0 _uhttp://site.ebrary.com/lib/rucke/Doc?id=10079920
_zAn electronic book accessible through the World Wide Web; click to view
999 _c54065
_d54065