000			01354nam a2200289 a 4500
001			ebr10323517
003			CaPaEBR
006			m u
007			cr cn|||||||||
008			091007s1996 ohua s 100 0 eng d
020			_z9780871705826
020			_z0871705826
040			_aCaPaEBR _cCaPaEBR
035			_a(OCoLC)646817905
050	1	4	_aTK7871 _b.I58 1996eb
111	2		_aInternational Symposium for Testing and Failure Analysis _n(22nd : _d1996 : _cLos Angeles, Calif.)
245	1	0	_aISTFA '96 _h[electronic resource] : _bproceedings of the 22nd International Symposium for Testing and Failure Analysis : 18-22 November 1996, Los Angeles, California.
260			_aMaterials Park, Ohio : _bASM International, _cc1996.
300			_axiv, 417 p. : _bill.
533			_aElectronic reproduction. _bPalo Alto, Calif. : _cebrary, _d2013. _nAvailable via World Wide Web. _nAccess may be limited to ebrary affiliated libraries.
650		0	_aElectronics _xMaterials _xTesting _vCongresses.
650		0	_aElectronic apparatus and appliances _xTesting _vCongresses.
655		7	_aElectronic books. _2local
710	2		_aASM International. _bElectronic Materials and Processing Division.
710	2		_aebrary, Inc.
856	4	0	_uhttp://site.ebrary.com/lib/rucke/Doc?id=10323517 _zAn electronic book accessible through the World Wide Web; click to view
999			_c54755 _d54755