000			01556nam a2200313Ia 4500
001			ebr10328960
003			CaPaEBR
006			m u
007			cr cn|||||||||
008			041208s2004 ohua sb 101 0 eng d
020			_z9780871708078
020			_z0871708078
040			_aCaPaEBR _cCaPaEBR
035			_a(OCoLC)646827305
050	1	4	_aTK7871 _b.I68 2004eb
111	2		_aInternational Symposium for Testing and Failure Analysis _n(30th : _d2004 : _cBoston, Mass.)
245	1	0	_aISTFA 2004 _h[electronic resource] : _bproceedings of the 30th International Symposium for Testing and Failure Analysis, November 14-18, 2004, Worcester's Centrum Centre, Worcester (Boston), Massachusetts / _csponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2004, ASTM International.
260			_aMaterials Park, OH : _bASM International, _cc2004.
300			_a[717] p. : _bill.
504			_aIncludes bibliographical references and index.
533			_aElectronic reproduction. _bPalo Alto, Calif. : _cebrary, _d2009. _nAvailable via World Wide Web. _nAccess may be limited to ebrary affiliated libraries.
650		0	_aElectronics _xMaterials _xTesting _vCongresses.
650		0	_aElectronic apparatus and appliances _xTesting _vCongresses.
655		7	_aElectronic books. _2local
710	2		_aASM International.
710	2		_aElectronic Device Failure Analysis Society.
710	2		_aebrary, Inc.
856	4	0	_uhttp://site.ebrary.com/lib/rucke/Doc?id=10328960 _zAn electronic book accessible through the World Wide Web; click to view
999			_c54774 _d54774