000 01563nam a2200325Ia 4500
001 ebr10330016
003 CaPaEBR
006 m u
007 cr cn|||||||||
008 021220s2002 ohua sbf 001 0 eng d
020 _z0871707691
020 _z9780871707697
040 _aCaPaEBR
_cCaPaEBR
035 _a(OCoLC)609419839
050 1 4 _aTK7871
_b.M52 2002eb
245 0 0 _aMicroelectronic failure analysis
_h[electronic resource] :
_bdesk reference.
_p2002 supplement /
_cprepared under the direction of the Electronic Device Failure Analysis Society publications committee.
260 _aMaterials Park, OH :
_bASM International,
_cc2002.
300 _avi, 210 p. :
_bill.
504 _aIncludes bibliographical references and index.
533 _aElectronic reproduction.
_bPalo Alto, Calif. :
_cebrary,
_d2009.
_nAvailable via World Wide Web.
_nAccess may be limited to ebrary affiliated libraries.
650 0 _aElectronic apparatus and appliances
_xTesting
_vHandbooks, manuals, etc.
650 0 _aElectronics
_xMaterials
_xTesting
_vHandbooks, manuals, etc.
650 0 _aMicroelectronics
_xMaterials
_xDefects
_vHandbooks, manuals, etc.
650 0 _aMicroelectronics
_xMaterials
_xTesting
_vHandbooks, manuals, etc.
650 0 _aSemiconductors
_xDefects
_vHandbooks, manuals, etc.
655 7 _aElectronic books.
_2local
710 2 _aElectronic Device Failure Analysis Society.
710 2 _aebrary, Inc.
856 4 0 _uhttp://site.ebrary.com/lib/rucke/Doc?id=10330016
_zAn electronic book accessible through the World Wide Web; click to view
999 _c55422
_d55422