000			01822nam a2200349Ia 4500
001			ebr10320340
003			CaPaEBR
006			m u
007			cr cn|||||||||
008			071127s2007 ohua sb 101 0 eng d
020			_z0871708639
020			_z9780871708632
040			_aCaPaEBR _cCaPaEBR
035			_a(OCoLC)647828198
050	1	4	_aTK7871 _b.I6847 2007eb
111	2		_aInternational Symposium for Testing and Failure Analysis _n(33rd : _d2007 : _cSan Jose, Calif.)
245	1	0	_aISTFA 2007 _h[electronic resource] : _bproceedings of the 33rd International Symposium for Testing and Failure Analysis, November 4-8, 2007, San Jose McEnery Convention Center, San Jose, California, USA / _csponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2007, ASM International.
246	3	0	_aProceedings of the 33rd International Symposium for Testing and Failure Analysis
246	3	0	_a33rd International Symposium for Testing and Failure Analysis
246	3		_aThirty-third International Symposium for Testing and Failure Analysis
260			_aMaterials Park, OH : _bASM International, _cc2007.
300			_axvi, 356 p. : _bill.
504			_aIncludes bibliographical references and index.
533			_aElectronic reproduction. _bPalo Alto, Calif. : _cebrary, _d2009. _nAvailable via World Wide Web. _nAccess may be limited to ebrary affiliated libraries.
650		0	_aElectronics _xMaterials _xTesting _vCongresses.
650		0	_aElectronic apparatus and appliances _xTesting _vCongresses.
655		7	_aElectronic books. _2local
710	2		_aASM International.
710	2		_aElectronic Device Failure Analysis Society.
710	2		_aebrary, Inc.
856	4	0	_uhttp://site.ebrary.com/lib/rucke/Doc?id=10320340 _zAn electronic book accessible through the World Wide Web; click to view
999			_c60845 _d60845