000			01896nam a2200421 i 4500
001			ebr10910126
003			CaPaEBR
006			m o d
007			cr cn|||||||||
008			140828t20142014njua ob 001 0 eng d
020			_z9781118831335
020			_a9781118831359 (e-book)
040			_aCaPaEBR _beng _erda _epn _cCaPaEBR
035			_a(OCoLC)885378211
050	1	4	_aTK7870.15 _b.A3236 2014eb
082	0	4	_a621.381/046 _223
245	0	0	_aAdhesion in microelectronics / _cedited by K. L. Mittal and Tanweer Ahsan.
264		1	_aHoboken, New Jersey ; _aSalem, Massachusetts : _bScrivener Publishing : _bWiley, _c2014.
264		4	_c�2014
300			_a1 online resource (367 pages) : _billustrations.
336			_atext _2rdacontent
337			_acomputer _2rdamedia
338			_aonline resource _2rdacarrier
490	1		_aAdhesion and Adhesives: Fundamental and Applied Aspects
504			_aIncludes bibliographical references and index.
588			_aDescription based on print version record.
590			_aElectronic reproduction. Palo Alto, Calif. : ebrary, 2014. Available via World Wide Web. Access may be limited to ebrary affiliated libraries.
650		0	_aMicroelectronic packaging _xMaterials.
650		0	_aAdhesives.
650		0	_aAdhesive joints.
655		0	_aElectronic books.
700	1		_aMittal, K. L., _d1945- _eeditor.
700	1		_aAhsan, Tanweer, _eeditor.
776	0	8	_iPrint version: _tAdhesion in microelectronics. _dHoboken, New Jersey ; Salem, Massachusetts : Scrivener Publishing ; Wiley, c2014 _hxiv, 347 pages _kAdhesion and adhesives. Fundamental and applied aspects. _z9781118831335 _w2014029765
797	2		_aebrary.
830		0	_aAdhesion and adhesives. _pFundamental and applied aspects.
856	4	0	_uhttp://site.ebrary.com/lib/rucke/Doc?id=10910126 _zAn electronic book accessible through the World Wide Web; click to view
999			_c71891 _d71891