000			01520nam a2200301Ia 4500
001			ebr10323479
003			CaPaEBR
006			m u
007			cr cn|||||||||
008			051221s2005 ohua sb 101 0 eng d
020			_z087170823X
040			_aCaPaEBR _cCaPaEBR
035			_a(OCoLC)646817795
050	1	4	_aTK7871 _b.I63 2005eb
111	2		_aInternational Symposium for Testing and Failure Analysis _n(31st : _dd2005 : _cSan Jose, Calif.)
245	1	0	_aISTFA 2005 _h[electronic resource] : _bProceedings of the 31st International Symposium for Testing and Failure Analysis, Movember 6-10, 2005, McEnery Convention Center, San Jose, California / _csponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2005, ASTM International.
260			_aMaterials Park, OH : _bASM International, _cc2005.
300			_axviii, 524 p. : _bill.
504			_aIncludes bibliographical references and index.
533			_aElectronic reproduction. _bPalo Alto, Calif. : _cebrary, _d2009. _nAvailable via World Wide Web. _nAccess may be limited to ebrary affiliated libraries.
650		0	_aElectronics _xMaterials _xTesting _vCongresses.
650		0	_aElectronic apparatus and appliances _xTesting _vCongresses.
655		7	_aElectronic books. _2local
710	2		_aASM International.
710	2		_aElectronic Device Failure Analysis Society.
710	2		_aebrary, Inc.
856	4	0	_uhttp://site.ebrary.com/lib/rucke/Doc?id=10323479 _zAn electronic book accessible through the World Wide Web; click to view
999			_c75490 _d75490