000			01225nam a2200289Ia 4500
001			ebr10132649
003			CaPaEBR
006			m u
007			cr cn|||||||||
008			000815s2006 enk s 000 0 eng d
020			_z184663010X
040			_aCaPaEBR _cCaPaEBR
035			_a(OCoLC)133162498
050	1	4	_aTK7870.15 _b.A48 2006eb
245	0	0	_aAdvanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging _h[electronic resource] / _cguest editors Christopher Bailey and Johan Liu.
260			_aBradford, England : _bEmerald Group Publishing, _cc2006.
300			_a72 p.
490	0		_aSoldering & surface mount technology ; _vv.18, no. 2
533			_aElectronic reproduction. _bPalo Alto, Calif. : _cebrary, _d2009. _nAvailable via World Wide Web. _nAccess may be limited to ebrary affiliated libraries.
650		0	_aManufacturing processes.
650		0	_aElectronic packaging.
655		7	_aElectronic books. _2local
700	1		_aBailey, Christopher.
700	1		_aLiu, Johan.
710	2		_aebrary, Inc.
856	4	0	_uhttp://site.ebrary.com/lib/rucke/Doc?id=10132649 _zAn electronic book accessible through the World Wide Web; click to view
999			_c79489 _d79489