Modeling and simulation for microelectronic packaging assembly (Record no. 129875)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 01904nam a2200373 a 4500 |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.381/046 |
| 100 1# - MAIN ENTRY--AUTHOR NAME | |
| Personal name | Liu, S. |
| 245 10 - TITLE STATEMENT | |
| Title | Modeling and simulation for microelectronic packaging assembly |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication | Hoboken, N.J. : |
| Name of publisher | Wiley, |
| Year of publication | 2011. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | xxii, 564 p. : |
| Other physical details | ill. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical Term | Microelectronic packaging |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Liu, Yong, |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://site.ebrary.com/lib/rucke/Doc?id=10494525 |
| 520 ## - SUMMARY, ETC. | |
| -- | Provided by publisher. |
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