Includes bibliographical references and index.

pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging.

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- Provided by publisher.

Electronic reproduction. Palo Alto, Calif. : ebrary, 2011. Available via World Wide Web. Access may be limited to ebrary affiliated libraries.