Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging (Record no. 79489)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 01225nam a2200289Ia 4500 |
| 245 00 - TITLE STATEMENT | |
| Title | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication | Bradford, England : |
| Name of publisher | Emerald Group Publishing, |
| Year of publication | c2006. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | 72 p. |
| 490 0# - SERIES STATEMENT | |
| Series statement | Soldering & surface mount technology ; |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical Term | Manufacturing processes. |
| Topical Term | Electronic packaging. |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Bailey, Christopher. |
| Personal name | Liu, Johan. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://site.ebrary.com/lib/rucke/Doc?id=10132649 |
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