Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu.
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TextSeries: Soldering & surface mount technology ; v.18, no. 2Publication details: Bradford, England : Emerald Group Publishing, c2006.Description: 72 pSubject(s): Genre/Form: LOC classification: - TK7870.15 .A48 2006eb
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Electronic reproduction. Palo Alto, Calif. : ebrary, 2009. Available via World Wide Web. Access may be limited to ebrary affiliated libraries.
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