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Results of search for 'su:"Electronic packaging."'
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Authors
Bailey, Christopher
Cheung, Peter Y. K.
Liu, Johan
Liu, S.
Luo, Xiaobing
National Research Co...
Prasad, Shankara K.
Sousa, Jos�e T. de
Wu, Andy
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Applied Mechanics an...
Frontiers in electro...
Soldering & surface ...
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Boundary scan testin...
Electrical engineeri...
Electric contacts
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Electronic packaging
Light emitting diode...
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Your search returned 11 results.
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1.
Image from Google Jackets
Materials for high-density electronic packaging and interconnection
[electronic resource] :
report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
by
National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging
ebrary, Inc
Material type:
Text
; Format:
electronic available online
; Literary form:
Not fiction
Publication details:
Washington, D.C. : Alexandria, VA :
National Academy Press ; Available from Defense Technical Information Center, Cameron Station,
1990
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
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2.
Image from Google Jackets
Boundary-scan interconnect diagnosis
[electronic resource] /
Jos�e T. de Sousa, Peter Y.K. Cheung.
by
Sousa, Jos�e T. de
Cheung, Peter Y. K
ebrary, Inc
Series:
Frontiers in electronic testing
; 18.
Material type:
Text
; Format:
electronic available online
; Literary form:
Not fiction
Publication details:
Boston :
Kluwer Academic Publishers,
c2001
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
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3.
Image from Google Jackets
Advanced wirebond interconnection technology
[electronic resource] /
by Shankara K. Prasad.
by
Prasad, Shankara K
ebrary, Inc
Material type:
Text
; Format:
electronic available online
; Literary form:
Not fiction
Publication details:
Boston :
Kluwer Academic Publishers,
2004
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
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(remove)
4.
Image from Google Jackets
Advanced wirebond interconnection technology
[electronic resource] /
by Shankara K. Prasad.
by
Prasad, Shankara K
ebrary, Inc
Material type:
Text
; Format:
electronic available online
; Literary form:
Not fiction
Publication details:
Boston :
Kluwer Academic Publishers,
2004
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
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(remove)
5.
Image from Google Jackets
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
[electronic resource] /
guest editors Christopher Bailey and Johan Liu.
by
Bailey, Christopher
Liu, Johan
ebrary, Inc
Series:
Soldering & surface mount technology
; v.18, no. 2
Material type:
Text
; Format:
electronic available online
; Literary form:
Not fiction
Publication details:
Bradford, England :
Emerald Group Publishing,
c2006
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
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6.
Image from Google Jackets
Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /
edited by Andy Wu.
by
Wu, Andy
[editor.]
Series:
Applied mechanics and materials
; Volume 509.
Material type:
Text
; Format:
available online
; Literary form:
Not fiction
Publisher:
Zurich, Switzerland :
TTP,
2014
Copyright date:
�2014
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
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7.
Image from Google Jackets
LED packaging for lighting applications
[electronic resource] :
design, manufacturing, and testing /
Sheng Liu, Xiaobing Luo.
by
Liu, S. (Sheng)
, 1963-
Luo, Xiaobing
, 1974-
Chemical Industry Press
ebrary, Inc
Material type:
Text
; Format:
electronic available online
; Literary form:
Not fiction
Publication details:
Hoboken, N.J. :
Wiley,
2011
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
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(remove)
8.
Image from Google Jackets
Materials for high-density electronic packaging and interconnection
[electronic resource] :
report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
by
National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging
ebrary, Inc
Material type:
Text
; Format:
electronic available online
; Literary form:
Not fiction
Publication details:
Washington, D.C. : Alexandria, VA :
National Academy Press ; Available from Defense Technical Information Center, Cameron Station,
1990
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
Save to lists
Add to cart
(remove)
9.
Image from Google Jackets
Boundary-scan interconnect diagnosis
[electronic resource] /
Jos�e T. de Sousa, Peter Y.K. Cheung.
by
Sousa, Jos�e T. de
Cheung, Peter Y. K
ebrary, Inc
Series:
Frontiers in electronic testing
; 18.
Material type:
Text
; Format:
electronic available online
; Literary form:
Not fiction
Publication details:
Boston :
Kluwer Academic Publishers,
c2001
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
Save to lists
Add to cart
(remove)
10.
Image from Google Jackets
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
[electronic resource] /
guest editors Christopher Bailey and Johan Liu.
by
Bailey, Christopher
Liu, Johan
ebrary, Inc
Series:
Soldering & surface mount technology
; v.18, no. 2
Material type:
Text
; Format:
electronic available online
; Literary form:
Not fiction
Publication details:
Bradford, England :
Emerald Group Publishing,
c2006
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
Save to lists
Add to cart
(remove)
11.
Image from Google Jackets
LED packaging for lighting applications
[electronic resource] :
design, manufacturing, and testing /
Sheng Liu, Xiaobing Luo.
by
Liu, S. (Sheng)
, 1963-
Luo, Xiaobing
, 1974-
Chemical Industry Press
ebrary, Inc
Material type:
Text
; Format:
electronic available online
; Literary form:
Not fiction
Publication details:
Hoboken, N.J. :
Wiley,
2011
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
Save to lists
Add to cart
(remove)
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