Results of search for 'su:"Packaging."' › Rongo Univesity Library catalog

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Food contact rubbers 2 [electronic resource] : products, migration and regulation / Martin J. Forrest. by

Series: Rapra review reports. Report 182 ; ; v. 16, no. 2.

Material type:

Text; Format: electronic available online remote

; Literary form: Not fiction

Publication details: Shawbury, U.K. : Rapra Technology Ltd., 2006

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

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Regulation of food packaging in Europe and the USA [electronic resource] / Derek J. Knight and Lesley A. Creighton. by

Series: Rapra review reports ; v. 15, no. 5.

Material type:

Text; Format: electronic available online remote

; Literary form: Not fiction

Publication details: Shawbury, U.K. : Rapra Technology Ltd., 2004

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

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Additive migration from plastics into foods [electronic resource] : a guide for analytical chemists / T.R. Crompton. by

Material type:

Text; Format: electronic available online remote

; Literary form: Not fiction

Publication details: Shawbury, U.K. : Smithers Rapra Technology Ltd., c2007

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

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Rigid plastics packaging [electronic resource] : materials, processes and applications / F. Hannay. by

Series: Report (Rapra Technology Limited) ; 151. | Rapra review reports ; v. 13, no. 7, 2002.

Material type:

Text; Format: electronic available online remote

; Literary form: Not fiction

Publication details: Shrewsbury, U.K. : Rapra Technology, 2002

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

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Assessing food safety of polymer packaging [electronic resource] / Jean-Maurice Vergnaud, Iosif-Daniel Rosca. by

Material type:

Text; Format: electronic available online remote

; Literary form: Not fiction

Publication details: Shrewsbury, Shropshire : Rapra Technology, 2006

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

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Materials for high-density electronic packaging and interconnection [electronic resource] : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. by

Material type:

Text; Format: electronic available online remote

; Literary form: Not fiction

Publication details: Washington, D.C. : Alexandria, VA : National Academy Press ; Available from Defense Technical Information Center, Cameron Station, 1990

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

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Boundary-scan interconnect diagnosis [electronic resource] / Jos�e T. de Sousa, Peter Y.K. Cheung. by

Series: Frontiers in electronic testing ; 18.

Material type:

Text; Format: electronic available online remote

; Literary form: Not fiction

Publication details: Boston : Kluwer Academic Publishers, c2001

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

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Advanced wirebond interconnection technology [electronic resource] / by Shankara K. Prasad. by

Material type:

Text; Format: electronic available online remote

; Literary form: Not fiction

Publication details: Boston : Kluwer Academic Publishers, 2004

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

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Adhesion in microelectronics / edited by K. L. Mittal and Tanweer Ahsan. by

Series: Adhesion and adhesives. Fundamental and applied aspects.

Material type:

Text; Format: available online remote

; Literary form: Not fiction

Publisher: Hoboken, New Jersey ; Salem, Massachusetts : Scrivener Publishing : Wiley, 2014Copyright date: �2014

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

10.

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Food contact materials [electronic resource] : rubbers, silicones, coatings and inks / Martin Forrest. by

Material type:

Text; Format: electronic available online remote

; Literary form: Not fiction

Publication details: Shawbury : iSmithers, c2009

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

11.

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Lead-free solder interconnect reliability [electronic resource] / edited by Dongkai Shangguan. by

Material type:

Text; Format: electronic available online remote

; Literary form: Not fiction

Publication details: Materials Park, OH : ASM International, 2005

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

12.

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Handbook of paper and paperboard packaging technology [electronic resource] / edited by Mark J. Kirwan. by

Edition: 2nd ed.

Material type:

Text; Format: electronic available online remote

; Literary form: Not fiction

Publication details: Chichester, West Sussex ; Ames, Iowa : Wiley-Blackwell, 2013

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

13.

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Advanced wirebond interconnection technology [electronic resource] / by Shankara K. Prasad. by

Material type:

Text; Format: electronic available online remote

; Literary form: Not fiction

Publication details: Boston : Kluwer Academic Publishers, 2004

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

14.

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Adhesion in microelectronics / edited by K. L. Mittal and Tanweer Ahsan. by

Series: Adhesion and adhesives. Fundamental and applied aspects.

Material type:

Text; Format: available online remote

; Literary form: Not fiction

Publisher: Hoboken, New Jersey ; Salem, Massachusetts : Scrivener Publishing : Wiley, 2014Copyright date: �2014

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

15.

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Packaging for nonthermal processing of food [electronic resource] / edited by Jung H. Han. by

Series: IFT Press series

Edition: 1st ed.

Material type:

Text; Format: electronic available online remote

; Literary form: Not fiction

Publication details: Ames, Iowa : Blackwell Pub. : IFT Press, 2007

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

16.

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Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu. by

Series: Soldering & surface mount technology ; v.18, no. 2

Material type:

Text; Format: electronic available online remote

; Literary form: Not fiction

Publication details: Bradford, England : Emerald Group Publishing, c2006

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

17.

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Research on food packaging technology : selected, peer reviewed papers from the 2013 China Academic Conference on Food Packaging, November 23-25, 2013, Tianjin, China / edited by Ouyang Yun [and three others]. by

Series: Applied mechanics and materials ; v. 469.

Material type:

Text; Format: available online remote

; Literary form: Not fiction

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

18.

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Green printing and packaging materials : selected, peer-reviewed papers from the 2011 China Academic Conference on Green Printing and Packaging Materials, August 20-23, 2011, Harbin China / edited by Ouyang Yun, Xui Min and Yang Li. by

Series: Advanced materials research ; v. 380.

Material type:

Text; Format: available online remote

; Literary form: Not fiction

Publisher: Zurich, Switzerland : Trans Tech Publications, 2012Copyright date: �2012

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

19.

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Food biochemistry and food processing [electronic resource]. by

Edition: 2nd ed. / edited by Benjamin K. Simpson ... [et al.].

Material type:

Text; Format: electronic available online remote

; Literary form: Not fiction

Publication details: Ames, Iowa : Wiley-Blackwell, 2012

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

20.

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Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / edited by Andy Wu. by

Wu, Andy [editor.]

Series: Applied mechanics and materials ; Volume 509.

Material type:

Text; Format: available online remote

; Literary form: Not fiction

Publisher: Zurich, Switzerland : TTP, 2014Copyright date: �2014

Online resources:

An electronic book accessible through the World Wide Web; click to view

Availability: No items available.

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