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Results of search for 'su:"Microelectronic packaging"'
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Authors
Ahsan, Tanweer
Liu, S.
Liu, Yong
Mittal, K. L.
Shangguan, Dongkai
Wu, Andy
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Series
Adhesion and Adhesiv...
Applied Mechanics an...
Topics
Adhesive joints
Adhesives
Electronic apparatus...
Electronic packaging
Lead-free electronic...
Manufacturing proces...
Microelectronic pack...
Solder and soldering
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Your search returned 8 results.
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1.
Image from Google Jackets
Adhesion in microelectronics /
edited by K. L. Mittal and Tanweer Ahsan.
by
Mittal, K. L
, 1945-
[editor.]
Ahsan, Tanweer
[editor.]
Series:
Adhesion and adhesives
. Fundamental and applied aspects.
Material type:
Text
; Format:
available online
; Literary form:
Not fiction
Publisher:
Hoboken, New Jersey ;
Salem, Massachusetts :
Scrivener Publishing :
Wiley,
2014
Copyright date:
�2014
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
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2.
Image from Google Jackets
Lead-free solder interconnect reliability
[electronic resource] /
edited by Dongkai Shangguan.
by
Shangguan, Dongkai
, 1963-
ebrary, Inc
Material type:
Text
; Format:
electronic available online
; Literary form:
Not fiction
Publication details:
Materials Park, OH :
ASM International,
2005
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
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(remove)
3.
Image from Google Jackets
Adhesion in microelectronics /
edited by K. L. Mittal and Tanweer Ahsan.
by
Mittal, K. L
, 1945-
[editor.]
Ahsan, Tanweer
[editor.]
Series:
Adhesion and adhesives
. Fundamental and applied aspects.
Material type:
Text
; Format:
available online
; Literary form:
Not fiction
Publisher:
Hoboken, New Jersey ;
Salem, Massachusetts :
Scrivener Publishing :
Wiley,
2014
Copyright date:
�2014
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
Save to lists
Add to cart
(remove)
4.
Image from Google Jackets
Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /
edited by Andy Wu.
by
Wu, Andy
[editor.]
Series:
Applied mechanics and materials
; Volume 509.
Material type:
Text
; Format:
available online
; Literary form:
Not fiction
Publisher:
Zurich, Switzerland :
TTP,
2014
Copyright date:
�2014
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
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(remove)
5.
Image from Google Jackets
Modeling and simulation for microelectronic packaging assembly
[electronic resource] :
manufacturing, reliability and testing /
Sheng Liu, Yong Liu.
by
Liu, S. (Sheng)
, 1963-
Liu, Yong
, 1962-
ebrary, Inc
Material type:
Text
; Format:
electronic available online
; Literary form:
Not fiction
Publication details:
Hoboken, N.J. :
Wiley,
2011
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
Save to lists
Add to cart
(remove)
6.
Image from Google Jackets
Lead-free solder interconnect reliability
[electronic resource] /
edited by Dongkai Shangguan.
by
Shangguan, Dongkai
, 1963-
ebrary, Inc
Material type:
Text
; Format:
electronic available online
; Literary form:
Not fiction
Publication details:
Materials Park, OH :
ASM International,
2005
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
Save to lists
Add to cart
(remove)
7.
Image from Google Jackets
Lead-free solder interconnect reliability
[electronic resource] /
edited by Dongkai Shangguan.
by
Shangguan, Dongkai
, 1963-
ebrary, Inc
Material type:
Text
; Format:
electronic available online
; Literary form:
Not fiction
Publication details:
Materials Park, OH :
ASM International,
2005
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
Save to lists
Add to cart
(remove)
8.
Image from Google Jackets
Modeling and simulation for microelectronic packaging assembly
[electronic resource] :
manufacturing, reliability and testing /
Sheng Liu, Yong Liu.
by
Liu, S. (Sheng)
, 1963-
Liu, Yong
, 1962-
ebrary, Inc
Material type:
Text
; Format:
electronic available online
; Literary form:
Not fiction
Publication details:
Hoboken, N.J. :
Wiley,
2011
Online resources:
An electronic book accessible through the World Wide Web; click to view
Availability:
No items available.
star rating
Average : 0.0 out of 5 stars
Save to lists
Add to cart
(remove)
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